License: 
Creative Commons Attribution 3.0 Unported license (CC BY 3.0)
When quoting this document, please refer to the following
DOI: 10.4230/DagRep.6.2.28
URN: urn:nbn:de:0030-drops-58606
URL: http://dagstuhl.sunsite.rwth-aachen.de/volltexte/2016/5860/
Chien, Chen-Fu ;
Ehm, Hans ;
Fowler, John ;
Mönch, Lars
Weitere Beteiligte (Hrsg. etc.): Chen-Fu Chien and Hans Ehm and John Fowler and Lars Mönch
Modeling and Analysis of Semiconductor Supply Chains (Dagstuhl Seminar 16062)
Abstract
In February 2016 the Dagstuhl Seminar 16062 explored the needs of the semiconductor industry for better planning and scheduling approaches at the supply chain level and the requirements for information systems to support the approaches. The seminar participants also spent time identifying the core elements of a conceptual reference model for planning and control of semiconductor manufacturing supply chains. This Executive Summary describes the process of the seminar and discusses key findings and areas for future research regarding these topics. Abstracts of presentations given during the seminar and the output of breakout sessions are collected in appendices.
BibTeX - Entry
@Article{chien_et_al:DR:2016:5860,
author = {Chen-Fu Chien and Hans Ehm and John Fowler and Lars M{\"o}nch},
title = {{Modeling and Analysis of Semiconductor Supply Chains (Dagstuhl Seminar 16062)}},
pages = {28--64},
journal = {Dagstuhl Reports},
ISSN = {2192-5283},
year = {2016},
volume = {6},
number = {2},
editor = {Chen-Fu Chien and Hans Ehm and John Fowler and Lars M{\"o}nch},
publisher = {Schloss Dagstuhl--Leibniz-Zentrum fuer Informatik},
address = {Dagstuhl, Germany},
URL = {http://drops.dagstuhl.de/opus/volltexte/2016/5860},
URN = {urn:nbn:de:0030-drops-58606},
doi = {10.4230/DagRep.6.2.28},
annote = {Keywords: Modeling, Simulation, Supply Chain Management, Semiconductor Manufacturing}
}
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Keywords: |
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Modeling, Simulation, Supply Chain Management, Semiconductor Manufacturing |
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Collection: |
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Dagstuhl Reports, Volume 6, Issue 2 |
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Issue Date: |
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2016 |
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Date of publication: |
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17.08.2016 |
